BGA Placement and BGA inspection services UK | Contract Production
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Improve the efficiency of your PCB assembly with a ball grid array (BGA)

As well as providing standard SMT (surface-mount technology) and through-hole PCB assembly, the experienced team at Contract Production is also able to offer ball grid array (BGA) and micro BGA (µBGA) placement and inspection.

Our capabilities for BGA placement and BGA inspection include:

  • BGA Soldering
  • BGA Rework and Repair
  • Automated Optical Inspection (AOI) for BGA. 
  • Solder Joint Inspection
  • High-Density PCB Assembly
  • Fine-Pitch Component Placement
  • Micro-BGA (µBGA) Assembly
BGA and micro BGA placement and BGA testing services

Why choose Contract Production for BGA placement and inspection?

We've investmented in the latest SMT pick-and-place equipment to ensure accurate and repeatable results for our customers, and because each new job has its own bespoke thermal profile associated with it, we make sure that your BGA assembly is manufactured under optimum soldering conditions every time it is processed.

Our extensive SMT placement capabilities are verified by AOI (automated optical inspection) and, subject to PCB design constraints, available with 360° inspection around each BGA device. If required, we can access third-party X-ray facilities to verify the placement accuracy and solder quality of your device in greater levels of detail.

A close up of a quality inspection of a PCB taking place

Quality assured in every job

Contract Production is committed to providing high-quality electronic manufacturing services and products. Stringent internal quality assurance procedures ensure that your electronic assemblies and finished products are manufactured to consistently high standards.

We are an ISO 9001:2015-accredited company and in addition to this certification, all our electronic assemblies are manufactured, inspected and released to the latest revision of the IPC-A-610 standard. Our in-house IPC-certified trainer ensures that ongoing compliance to the latest standard is maintained, providing the highest levels of confidence in our manufacturing procedures and processes at all times.

Prototyping, PCB assembly, box build and turnkey electronic manufacturing

Ask for a quote

Prototyping, PCB assembly, box build and turnkey electronic manufacturing

Ask for a quote

What our clients say

    "The performance, attention to detail, communication, quality of work, and understanding of our specific needs exceeded expectations. CPL are a pleasure to work with; genuine partners."

    - Gareth Connor (UK R&D and manufacture) and Danny White (USA Corporate President), Sound Techniques, Ltd. Calif. USA.

    "Contract Production manufacture to very exacting standards many of the more complex circuit board assemblies within our intrinsically safe products. In our experience we have enjoyed consistency in supply with competitive pricing and an excellent pre and post sales service."

    - Rod Huddart, Procurement and Pre-Production Engineering Manager - HMi Elements

    "We are extremely happy with the fantastic service and support given by Contract Production. Our product is mandated by the International Maritime Organisation which places additional controls over us and our supply chain. Contract Production understands the compliance requirements and ensures our product is of the highest quality possible."

    - Matthew Wright, Chief Technical Officer - Globalview Systems Ltd

    "We at Inductelec have been using Contract Production since the company launched as our primary PCB production company. We have found the company to be honest and dependable to deal with in every way and the resulting PCBs have been very accurately constructed and have had very few soldering or PCB errors. I would not hesitate to recommend them."

    - Dr. Isaac Sewell PhD MEng MIET, Technical Director - Inductelec Limited

    "Multisensor Systems has been a partner of Contract Production for the past two generations of its products and has built up a strong, mutually constructive relationship. Contract Production has consistently proved itself for reliability, flexibility and customer service of the highest order."

    - Brad Weaterton, Managing Director / CEO - Multisensor Systems

FAQs

Ball Grid Array (BGA) placement differs from standard SMT placement because the device pins are densely packed under the chip body and are not visible once the package is placed on the PCB. This provides additional challenges for the placement process and our AM100 SMT pick and place equipment is capable of picking, imaging and placing high pin count/fine pitch BGAs with exceptional accuracy, speed and repeatability.

Whilst accurate placement is crucial, ensuring all the contact pins are correctly soldered requires strict control of the reflow process and our state-of-the-art 8-zone reflow oven with built-in thermal profiling is capable of reflowing the most demanding, high pin count BGA devices with incredible levels of precision and accuracy.

BGA and µBGA packages are ideal for dense inter-connection requirements where space limitations are a concern. Unlike conventional ICs (integrated circuits), QFNs (quad flat no-leads packages) and QFPs (quad flat packages), the connection pins of a BGA are available across the entire bottom surface of the device and not just around the edges, translating to greater functionality in a more compact, space-saving footprint.

We have over 10 years of experience with BGA assembly, including fine-pitch and micro-BGAs. Our technicians are trained in IPC standards for BGA placement and rework.

We use precision pick-and-place machines and AOI equipment to ensure accurate placement and solder joint integrity.

We optimise reflow oven profiles for each BGA type, ensuring even heating and preventing defects like voids or warping.

We use optimised solder paste application, controlled reflow processes, and thorough inspection to minimise defects.

We perform AOI inspection, functional testing, and thermal cycling to ensure long-term reliability of BGA assemblies.